AI chip demand 結果共3筆

Hon Hai Precision Industry Chairman Young Liu has stated that the AI server industry is facing a shortage of AI chips, which is expected to persist throughout 2024. Liu emphasized that the problem can only be resolved by increasing production capacity in new factories. He also highlighted that geopolitical and economic conditions may affect the demand for consumer electronic products this year. Despite holding a significant position in the global AI server industry, Hon Hai is facing a shortfall in the supply of AI chips from major manufacturers like NVIDIA. While some second and third-tier factories claim their AI server performance will be good in 2024, Liu expressed skepticism and confusion about this situation.

The smartphone market is set to rebound in 2024, according to Rick Tsai, chairman of MediaTek Inc., a global chip leader. Tsai attributes this growth to the increasing popularity of AI applications, which is driving the replacement of mobile phones and PCs and creating a higher demand for devices. Under Tsai’s leadership, MediaTek has released advanced products such as the Tianji 9300, a flagship 5G chip that supports generative AI applications. Qualcomm, another major chip company, is also capitalizing on the AI trend with its latest 5G handset chip, Snapdragon 8 Gen 3, which offers AI support for enhanced user experiences. Both companies anticipate a surge in AI smartphone upgrades due to improved computing power and a wider range of applications.

Taiwan Semiconductor Manufacturing Company (TSMC) predicts a surge in artificial intelligence (AI) orders in the coming year, with October’s revenue reaching NT$243.203 billion ($8.6 billion), a 34.8 percent monthly increase and a 15.7 percent annual increase. TSMC’s stock price has also been on a steady rise, accumulating a growth of 7.5 percent since November. Morgan Stanley semiconductor research analyst Charlie Chan attributes TSMC’s revenue growth to signs of recovery and the robust demand for AI semiconductors worldwide. NVIDIA’s expanded order to TSMC, along with increased demand from clients like Apple and Advanced Micro Devices (AMD), has led TSMC to accelerate the enhancement of its advanced packaging technology, Chip on Wafer on Substrate (CoWoS). CoWoS enables TSMC to effectively reduce costs and trim electric consumption by packaging chiplets on a silicon interposer and placing them on a package substrate. However, TSMC’s current CoWoS capacity remains a bottleneck for NVIDIA’s AI GPU chips, though the company forecasts a rebound in productivity by the end of 2024 to meet customer demand.